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RoHS CompliantRTV Silicones by Momentive Performance Materials (Formerly GE Silicones)
2-Part Potting/Encapsulating Compound TSE3331
Special Order 
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MSDS
Catalyst options/MSDS
Primer options/MSDS
Specifications
Available Sizes



Related products:
  RTV1032 White (1 part)
TSE3941 White (1part)


Selection Guide RTV Selection Guide
One Part Chart
Two Part Chart



General Purpose

Aerospace

Marine

High Performance Assembly

Electronics

Thermal Conductivity

High Temperature

Low Temperature
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Primary Characteristics
Gray Flowable
Thermally conductive
Meets UL94 V-0
Meets UL File #E36952
Addition cure
Thermally conductive

General Purpose potting

Use for:
Potting or encapsulation of power supply / transformer assemblies that require good thermal dissipation

TSE3331 silicone rubber compound is a two component, heat curing liquid silicone for potting and encapsulation where flammability and/or thermal conductivity is of concern. It provides excellent flame retardant properpties (UL94 V-0) and very stable dielectric properties over a broad range of operating temperatures. In addition, TSE3331 silicone rubber compound also offers superior thermal conductivity properties when compared to other conventional silicone encapsulants. This product must be cured in a well ventilated oven.

Available Sizes

Catalog No. Description  
TSE3331A-1K TSE3331(A)-1K Special Order 

TSE3331B-1K

TSE3331(B)-1Kg Special Order 
TSE3331 requires a primer. Visit our primer guide for details.

Specifications

UseAdhesive Sealant
Special FeatureThermally Conductive
StandardsUL 94 V-0
UL File #E36952
Cross ReferenceTSE3331
Uncured Properties
ConsistencyEasily pourable
ColorGray
Specific Gravity1.51
Tack Free Time8 hours
Cure Through Time10 min. @ 100°C
 5 min. @ 150°C
 2 min. @ 200°C
Useful Temp. Range -60°C to 204°C
(-75°F to 400°F)
Cured Properties - MECHANICAL
Hardness60 (Shore A)
Tensile Strength3.24 MPa (426 psi)
Elongation50%
Tear Strength3.4 kg/cm (19 lb/in)
Peel Strength-
Cured Properties - ELECTRICAL
Volume Resistivity2.0 x 1014 ohm · cm
Dielectric Strength26 kV/mm
 661 V/mil
Dielectric Constant3.3 @ 60 Hz
Cured Properties - THERMAL
Thermal Conductivity0.63 W/m · °K
Brittle Point-55°C (-67°F)
Thermal Expansion27 x 10-5 (°C)-1
Other
Viscosity (@ 25°C)3,500 cps
Mix Ratio (by weight) 1 : 1
Pot Life8 hours

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