Property |
Pre-treatment |
Index (FR-4) |
Surface Resistivity |
|
|
 After moisture resistance |
F |
≥ 10 4 M Ω |
At elevated temperature |
E-24/125 |
≥ 10 3 M Ω |
Volume Resistivity |
|
|
After moisture resistance |
F |
≥ 10 6 M Ω |
At elevated temperature |
E-24/125 |
≥ 10 3 M Ω.cm |
Dielectric breakdown
(parallel laminations) |
D-48/50+
D-0.5/23 |
≥ 40 KV |
Permittivity at 1 MHz |
C-40/23/50 |
≤ 5.4 |
Loss tangent at 1Mhz |
C-40/23/50 |
≤ 0.035 |
Arc resistance |
D-48/50+ D-0.5/23 |
≥ 60 S |
Peel strength 35 micron copper |
|
As received |
A |
≥ 1.40 N/mm |
After thermal stress |
A |
≥ 1.40 N/mm |
Solder limits |
288°C, 20S |
No delaminating |
|
260°C, 20S |
- |
Flexural strength |
|
|
Lengthwise |
A |
≥ 410 MPa |
Crosswise |
A |
≥ 340 MPa |
Water absorption |
|
- |
0.10-0.77 |
E-1/105+des+ D-24/23 |
≤ 0.80 % |
0.78-3.20 |
E-1/105+des+ D-24/23 |
≤ 0.35 % |
Flammability |
A&E-1/105+des |
94V-0 |
Dimensional stability |
E-4/105+des+E-2/150 |
±5.0 µm/cm |
Copper
Clad Boards
