Surface Resistivity

F

≥ 10 4 M Ω

At elevated temperature

E-24/125

≥ 10 3 M Ω

Volume Resistivity

After moisture resistance

F

≥ 10 6 M Ω

At elevated temperature

E-24/125

≥ 10 3 M Ω.cm

Dielectric breakdown
(parallel laminations)

D-48/50+
D-0.5/23

≥ 40 KV

Permittivity at 1 MHz

C-40/23/50

≤ 5.4

Loss tangent at 1Mhz

C-40/23/50

≤ 0.035

Arc resistance

D-48/50+ D-0.5/23

≥ 60 S

Peel strength 35 micron copper

As received

A

≥ 1.40 N/mm

After thermal stress

A

≥ 1.40 N/mm

Solder limits

288°C, 20S

No delaminating

260°C, 20S

-

Flexural strength

Lengthwise

A

≥ 410 MPa

Crosswise

A

≥ 340 MPa

Water absorption

-

0.10-0.77

E-1/105+des+ D-24/23

≤ 0.80 %

0.78-3.20

E-1/105+des+ D-24/23

≤ 0.35 %

Flammability

A&E-1/105+des

94V-0

Dimensional stability

E-4/105+des+E-2/150

±5.0 µm/cm