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RoHS Compliant High Temperature Epoxy Encapsulating and Potting Compound
Clear832HT 
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For encapsulating and potting electronics in high temperature environments, aggressive chemical environments, or where improved technology protection is desired. Bonds to a wide variety of substrates, including metals, glass, ceramics and many plastics.

Features / Benefits

  • Extreme physical strength and chemical resistance
  • Suitable for extreme environments, such as submersion in salt water, acids, bases, fuels, and alcohols
  • Protects against strong vibrations, abrasions, and direct physical impact
  • Extremely difficult to remove - grants incredible technology protection
  • Maximum service temperature of 275°C (527°F)

Typical Applications

  • Use in electronic assemblies to prevent vibration damage
  • Encapsulate circuits for the purpose of technological protection

 

Specifications

Cured Properties - Physical Test Method Result

Viscosity at 20 ºC (68 ºF) (Part A)

54,800 cps

Viscosity at 20 ºC (68 ºF) (Part B)

11,000 cps

Mixed Viscosity at 20 ºC (68 ºF)

40,000 cps

Mixing Ratio by Volume

2.0 : 1.0
(Part A: Part B)

Mixing Ratio by Mass

2.186 : 1.000
(Part A: Part B)

Maximum Service Temperature

275 ºC (527 ºF)

Maximum Intermittent Temperature

300 ºC (572 ºF)

Working Time (100 gram sample)

1 hour

Hardness, Shore D

80

Tensile Strength

ASTM-D-638-02a

7,861 PSI

Elongation

ASTM-D-638-02a

3.38%

Compressive Strength

ASTM-D-695-02a

11,870 PSI

Flexural Strength

ASTM-D-790-03

14,600 PSI

Flexural Modulus

ASTM-D-790-03

399,000 PSI

Lap Shear Strength

ASTM-D-1002-01

1,794 PSI

Coefficient of Thermal Expansion

ASTM-D-648-01

 

-40 ºC to 50 ºC 75.7x10-6 mm/mmºC
+100 ºC to +250 ºC

154.0x10-6 mm/mmºC

-40 ºC to +250 ºC

125.3x10-6 mm/mmºC

+25 ºC to + 250 ºC

140.2x10-6 mm/mmºC

Deflection Temperature Under Load

ASTM-D-648-01

53.9 ºC (129.02 ºF)

Thermal Conductivity

ASTM-E-1530-99

0.210 W/mºK

Thermal Conductivity @ 25 ºC (77ºF)

ASTM-E-1461-92

0.218 W /mºK

Thermal Diffusivity @ 25 ºC (77 ºF)

ASTM-E-1461-92

1.33 x 10-13 M2/s

Specific Heat Capacity @ 25 ºC (77 ºF)

ASTM-E-1269-01

1419 J/kgºK

Curing Time (100g)    
@ room temp.   24 hours
@ 65°C   60 minutes
@ 80°C   45 minutes
@ 100°C   35 minutes
@ 130°C   25 minutes
@ 160°C   15 minutes
@ 200°C   10 minutes
Cured Properties - Electrical Test Method Result
Corrected Dissipation Factor, D ASTM D150-98 0.007 @ 1KHz
  0.011 @ 10KHz
  0.014 @ 100KHz
  0.014 @ 1MKHz

Dielectric Constant

ASTM D150-98

4.24 @ 60Hz

    2.96 @ 1KHz
  2.81 @ 10KHz
  2.83 @ 100KHz

 

2.83 @ 1MKHz

Dissipation Factor

ASTM-D-150-98

0.0018 @ 60 Hz

Volume Resistivity

ASTM-D-257-99

9.3 x 1015 ohm · cm

Surface Resistivity

ASTM-D-257-99

5.3 x 1013 ohm

Dielectric Strength

ASTM D149-97a

1,138 V/mill @ 0.020”

 

ASTM D149-97a

326 V/mil @ 0.017”

Breakdown Voltage ASTM D149-97a 54.4 kV

832B Peak Exotherm

Sample Size (grams) Peak Exotherm
(Temp. in 0°C)
Time in Minutes
50 44 155
100 63 110
500 110 65

Available Sizes

Catalog NumberSizes AvailableDescription
832HT-375ML 375ml (12 oz)Liquid
832HT-3L 3L (0.8 gal)Liquid