• High thermal conductivity
• High dielectric constant
• High dissipation factor
• Use with heat sinks or metal chassis
• Will not dry or harden
• Contains zincs oxides and polydimenthyl siloxane
• Non-silicone version available

Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane.

Specifications

Physical Properties Test Method Non Silicone 8610 Silicone 860 Appearance Visual Off white / smooth paste White paste Consistency ASTM D 217 310-320   Specific Gravity @ 25°C (77°F)   2.5 min 2.3 min Bleed % 24 hours @ 200°C FTM-321 1.0% max 2.0% max Evaporation 24 hours @ 200°C FTM-321 2.0% max 2.0% max Dropping Point ASTM D-566 > 500°F (260°C) > 500°F (260°C) Min. operating temp.   -40°F/-40°F 55°F/48°C Max. operating temp.   200°C 200°C (consistent) 300°C (intermittent) Electrical Properties Test Method Non Silicone 8610 Silicone 860 Thermal Conductivity Hot Wire Method Heat Flow #36 °C in W/m·K (BTU in /(hr ft2  F) ) in W/m·K (BTU in /(hr ft2  F) )     0.773 (5.36) 0.657 (4.56) Dielectric Strength (0.05l gap) ASTM D-149 350 V/MIL 400 V/MIL Dielectric Constant @ 1000 Hz ASTM D- 150 4.4 3.81 Dissipation Factor @ 1000 Hz ASTM D 150 0.0021 0.0032 Resistivity @ 21°C ASTM D 150 6.38 x 1013 Ohm•cm 1.5 x 1015 Ohm•cm