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RoHS Compliant Non-Silicone Heat Transfer Compound
8610
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  • Special synthetic base, fortified with metal oxides and compounded to a paste-like consistency for ease of application
  • High efficient thermal conductive properties
    • Means more rapid transfer of heat for longer component life
  • High temperature stability
    • Provides physical properties of low bleed and low evaporation for long-term service in any application that requires Heat Sink Compound.
  • Uses synthetic fluids and metal oxide fillers
    • Provides excellent conductive properties that exceed those of other heat sink formulas
  • Will not dry, harden, melt or migrate in any heat sink application
  • Compatible with metal and plastic components
  • Also available in a silicone version

Benefits of Non Silicone Heat Transfer Compound OVER Silicone

No migration and component contamination.

Applications

  • Typically, Heat Transfer Compounds (heat sink compounds) are used in OEM Electronic Component Plants to insure fast, accurate heat transfer in electronic components and circuitry
  • Other used:
    • Semiconductor Mounting Devices
    • Thermal joints
    • Ballast heat transfer mediums
    • Power resistor mountings
    • Thermocouple wells
    • Transistor diodes & silicone rectifier base and mounting studs
    • ALL electric and electronic devices where efficient heat transfer cooling through thermal coupling is required

Specifications

Physical Properties Test Method Non Silicone
8610
Silicone
860
Appearance Visual Off white / smooth paste White paste
Consistency ASTM D 217 310-320  
Specific Gravity
@ 25°C (77°F)
  2.5 min 2.3 min
Bleed %
24 hours @ 200°C
FTM-321 1.0% max 2.0% max
Evaporation
24 hours @ 200°C
FTM-321 2.0% max 2.0% max
Dropping Point ASTM D-566 > 500°F (260°C) > 500°F (260°C)
Min. operating temp.   -40°F/-40°F 55°F/48°C
Max. operating temp.   200°C 200°C (consistent)
300°C (intermittent)
Electrical Properties Test Method Non Silicone
8610
Silicone
860
Thermal Conductivity Hot Wire Method Heat Flow #36 °C in W/m·K
(BTU in /(hr ft2  F) )
in W/m·K
(BTU in /(hr ft2  F) )
    0.773 (5.36) 0.657 (4.56)
Dielectric Strength
(0.05l gap)
ASTM D-149 350 V/MIL 400 V/MIL
Dielectric Constant @ 1000 Hz ASTM D- 150 4.4 3.81
Dissipation Factor
@ 1000 Hz
ASTM D 150 0.0021 0.0032
Resistivity @ 21°C ASTM D 150 6.38 x 1013 Ohm•cm 1.5 x 1015 Ohm•cm



Available Sizes

Catalog NumberSizes AvailableDescription
8610-60G60g (2 oz)Liquid - TUBE
8610-1P1 pint (2.5 lbs) Tub

Quick Links

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Specs

Sizes

Info on dispensing equipment (Cammda)

View an animated demonstration of how to apply Silicone Heat Transfer Compound


Non-Silicone Heat Transfer Compound
Animated demo of application

View an animated demonstration of how to apply Silicone Heat Transfer Compound

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