Q. How do I apply your Negative Dry Film without the air bubbles?
A. To reduce bubbles to an acceptable level during the laminating process, GRAB the two tail ends of the resist film (once rolling starts). One hand on the bottom left corner and one on bottom right corner. When you grab those two corners, give it some tension and lift it off the board a little WHILE it is being dragged in through the laminator.

REMEMBER, you only need to put it through the laminator ONCE. It may appear to have bubbles but it is just the protective film lifting off from the resist. Once you remove the protective film (just before exposure), the bubbles will be gone.

There still may be some bubbles in areas that are not desirable. If that is the case, use the following pen to touch over it. This pen works GREAT as an etch resist to protect the areas you do not want etched.

If you make a mistake and want to remove the resist, you may use our Resist Stripper (Cat. No. 4185-500ML) or an acetone based solvent (Cat. No. 435-55ML)